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SAMA5D2 Fiches technique(PDF) 47 Page - Microchip Technology |
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SAMA5D2 Fiches technique(HTML) 47 Page - Microchip Technology |
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47 / 56 page ![]() BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pad Spacing Contact Pitch MILLIMETERS 0.80 BSC MIN E MAX 14.40 Contact Pad Width (X20) X1 0.45 NOM C1 0 4 . 4 1 g n i c a p S d a P t c a t n o C E C2 C1 ØX1 SILK SCREEN Microchip Technology Drawing C04-23149-DYB Rev A 361-Ball Thin Fine Pitch Ball Grid Array (DYB) - 16x16 mm Body [TFBGA] Atmel Legacy Global Package Code CEP W V U T R P N M L K J H G F E D C B A 1 2 34 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SAMA5D2 SIP Mechanical Characteristics © 2021 Microchip Technology Inc. Datasheet DS60001484D-page 47 |
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