ADS5294 datasheet(57/67 Pages) TI1

57 / 67 page

ADS5294

www.ti.com

SLAS776B – NOVEMBER 2011 – REVISED JULY 2012

Custom Filter Coefficients

The filter coefficients can also be programmed by the user (customized). For custom coefficients, set the register

bit <FILTER COEFF SELECT> and load the coefficients (h0 to h11) in registers 0x5A to 0xB9, using the serial

interface as:

Board Design Considerations

Grounding

A single ground plane is sufficient to give good performance, provided the analog, digital, and clock sections of

the board are cleanly partitioned. See ADS5294VM Evaluation Module (SLAU355) for placement of components,

routing and grounding.

Supply Decoupling

Because the ADS5294 already includes internal decoupling, minimal external decoupling can be used without

loss in performance. For example, the ADS5294EVM uses a single 0.1 µF decoupling capacitor for each supply,

placed close to the device supply pins.

Packaging

Exposed Pad

The exposed pad at the bottom of the package is the main path for heat dissipation. Therefore, the pad must be

soldered to a ground plane on the PCB for best thermal performance. The pad must be connected to the ground

plane through the optimum number of vias.

Also, visit TI’s thermal website at www.ti.com/thermal.

Submit Documentation Feedback

Product Folder Link(s) :ADS5294

ADS5294 Fiches technique(PDF) 57 Page - Texas Instruments