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ADS5294 Fiches technique(PDF) 5 Page - Texas Instruments |
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ADS5294 Fiches technique(HTML) 5 Page - Texas Instruments |
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5 / 67 page ![]() ADS5294 www.ti.com SLAS776B – NOVEMBER 2011 – REVISED JULY 2012 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX Supply voltage AVDD –0.3 2.2 V LVDD –0.3 2.2 V between AGND and LGND –0.3 0.3 V at analog inputs –0.3 min[2.2, AVDD+0.3] V Voltage at digital inputs, CLKN, CLKP(2), RESET, SCLK, SDATA, CSZ –0.3 min[2.2, AVDD+0.3] V at digital outputs –0.3 min[2.2,LVDD+0.3] V Maximum junction temperature (TJ), any condition 105 °C Storage temperature range –55 150 °C Operating temperature range -40 85 °C Human Body Model (HBM) 2000 V ESD Ratings Charged Device Model (CDM) 500 V (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability. (2) When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKN is < |0.3V|. This prevents the ESD protection diodes at the clock input pins from turning on. THERMAL INFORMATION ADS5294 THERMAL METRIC(1) UNITS PFP (80 PINS) θJA Junction-to-ambient thermal resistance 30.8 θJCtop Junction-to-case (top) thermal resistance 6.3 θJB Junction-to-board thermal resistance 8.3 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 8.2 θJCbot Junction-to-case (bottom) thermal resistance 0.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s) :ADS5294 |
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