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PCF8811U/2DA/1 Fiches technique(PDF) 77 Page - NXP Semiconductors |
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PCF8811U/2DA/1 Fiches technique(HTML) 77 Page - NXP Semiconductors |
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77 / 81 page ![]() PCF8811_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 27 June 2008 77 of 81 NXP Semiconductors PCF8811 80 x 128 pixels matrix LCD driver The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pad location diagram (Figure 2) for the orientation and position of the type name on the die surface. 22. Abbreviations Fig 56. Tray alignment mgw771 PCF8811 Table 43. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal Oxide Semiconductor COG Chip-On-Glass DDRAM Double Data Random Access Memory ESD ElectroStatic Discharge HBM Human Body Model HV High Voltage IC Integrated Circuit ITO Indium Tin Oxide LCD Liquid Crystal Display LSB Least Significant Bit MM Machine Model MRA Multiple Row Addressing MSB Most Significant Bit MPU MicroProcessing Unit OTP One Time Programmable RAM Read Access Memory SPI Serial Peripheral Interface TC Temperature Coefficient TCP Tape Carrier Packages |
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