TMF8801 datasheet(69/73 Pages) OSRAM

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TMF8801

Soldering & Storage Information

Datasheet

• PUBLIC

DS000648

• v10-00 • 2022-Dec-20

│ 68

Parameter

Reference

Device

Time above 230 °C (T2)

Max 50 s

Time above Tpeak

– 10 °C (T3)

Max 10 s

Peak temperature in reflow

Tpeak

260 °C

Temperature gradient in cooling

Max −5 °C/s

12.2

Storage Information

12.2.1

Moisture Sensitivity

Optical characteristics of the device can be adversely affected during the soldering process by the

release and vaporization of moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of absorbed moisture possible, each device is

baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope

called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping,

handling, and storage before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture barrier bag is 24 months from the date

code on the bag when stored under the following conditions:

●

Shelf Life: 24 months

●

Ambient Temperature: <40 °C

●

Relative Humidity: <90 %

Rebaking of the devices will be required if the devices exceed the 24 month shelf life or the Humidity

Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture

region.

Floor Life

The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of

devices removed from the moisture barrier bag is 168 hours from the time the bag was opened,

provided that the devices are stored under the following conditions:

●

Floor Life: 168 hours

●

Ambient Temperature: <30 °C

●

Relative Humidity: <60 %

If the floor life or the temperature/humidity conditions have been exceeded, the devices must be

rebaked prior to solder reflow or dry packing.

TMF8801 Fiches technique(PDF) 69 Page - OSRAM GmbH

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