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MM32F103CET Fiches technique(PDF) 44 Page - MindMotion Microelectronics |
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MM32F103CET Fiches technique(HTML) 44 Page - MindMotion Microelectronics |
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44 / 89 page ![]() DS_MM32F103xx_o_Ver1.13 Electrical characteristics Symbol Definition Max Unit IIO Output current sunk by any I/O and control pin 20 mA IIO Output current source by any I/O and control pin -18 mA IINJ(PIN) ( 2)(3) Injected current on NRST pins ±5 mA IINJ(PIN) ( 2)(3) Injected current on OSC_IN pin of HSE and OSC_IN pin of LSE ±5 mA IINJ(PIN) ( 2)(3) Injected current on other pins(4) ±5 mA Σ IINJ(PIN) ( 2) Total injected current(sum of all I/O and control pins)(4) ±25 mA 1. All main power(VDD, VDDA) and ground(VSS, VSSA) pins must always be connected to the external power supply, in the permitted range. 2. IINJ(PIN) cannot exceed its limit, that is, to ensure that the VIN does not exceed its maximum value. If VIN does not guarantee that its maximum value is not exceeded, ensure that IINJ(PIN) does not exceed its maximum value under external restrictions. When VIN > VDD, there is a forward injection current; when VIN < VSS, there is a reverse injection current. 3. Negative injection disturbs the analog performance of the device. 4. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values). Table 9. Thermal characteristics Symbol Definition Max Unit TSTG Storage temperature range - 45 ∼ + 150 ◦C TJ Maximum junction temperature 125 ◦C 5.3 Operating conditions 5.3.1 General operating conditions Table 10. General operating conditions Symbol Parameter Conditions Min Max Unit fHCLK Internal AHB clock frequency 0 96 MHz fPCLK1 Internal APB1 clock frequency 0 fHCLK fPCLK2 Internal APB2 clock frequency 0 fHCLK VDD ( 1) Standard operating voltage 2.0 5.5 V www.mm32mcu.com 38/83 |
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