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EMC2302 Fiches technique(PDF) 62 Page - Microchip Technology |
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EMC2302 Fiches technique(HTML) 62 Page - Microchip Technology |
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62 / 70 page ![]() EMC2301/2/3/5 DS20006532A-page 62 2021 Microchip Technology Inc. Microchip Technology Drawing C04-381A Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Overall Length Terminal Length Exposed Pad Width Exposed Pad Length Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b D E2 D2 A3 e L E N 0.65 BSC 0.20 REF 2.00 0.40 0.25 0.80 0.00 0.30 4.00 BSC 0.50 2.10 0.90 0.02 4.00 BSC MILLIMETERS MIN NOM 16 2.20 0.60 0.35 1.00 0.05 MAX K- 0.35 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad 16-Lead Very Thin Plastic Quad Flat, No Lead Package (AP) - 4x4 mm Body [VQFN] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: SMSC Legacy AP [SQFN] 2.00 2.10 2.20 |
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