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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ATSAMB11XR Fiches technique(PDF) 75 Page - Microchip Technology |
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ATSAMB11XR Fiches technique(HTML) 75 Page - Microchip Technology |
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75 / 87 page  • The sealed bag has been open for > 168 hours. • Humidity Indicator Card reads >10%. • SiPs need to be baked for 8 hours at 125°C. Figure 15-1. Solder Reflow Profile 15.5 Module Assembly Considerations The Microchip ATSAMB11-ZR210CA module is manufactured without any conformal coating applied. It is the customer’s responsibility if a conformal coating is specified and or applied to the ATSAMB11- ZR210CA module. Solutions like IPA and similar solvents can be used to clean the ATSAMB11-ZR210CA module. However, cleaning solutions containing acid should never be used on the module. ATSAMB11XR/ZR © 2017 Microchip Technology Inc. Datasheet Preliminary DS70005342A-page 75 |
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