ATSAMB11XR datasheet(3/87 Pages) MICROCHIP

3 / 87 page

Table of Contents

Introduction......................................................................................................................1

Features.......................................................................................................................... 1

1. Ordering Information..................................................................................................6

2. Package Information..................................................................................................7

3. Block Diagram........................................................................................................... 8

4. Pinout Information..................................................................................................... 9

5. Device States.......................................................................................................... 14

5.1.

Description of Device States...................................................................................................... 14

5.2.

Power Sequences...................................................................................................................... 14

5.3.

Digital and Mixed-Signal I/O Pin Behavior during Power-Up Sequences.................................. 15

6. Clocking...................................................................................................................17

6.1.

Overview.................................................................................................................................... 17

6.2.

26 MHz Crystal Oscillator (XO).................................................................................................. 17

6.3.

32.768 kHz RTC Crystal Oscillator (RTC XO)............................................................................18

6.4.

2 MHz Integrated RC Oscillator..................................................................................................22

7. CPU and Memory Subsystem................................................................................. 24

7.1.

ARM Subsystem.........................................................................................................................24

7.2.

Memory Subsystem....................................................................................................................29

7.3.

Non-Volatile Memory.................................................................................................................. 29

8. Bluetooth Low Energy (BLE) Subsystem................................................................ 32

8.1.

BLE Core....................................................................................................................................32

8.2.

Features..................................................................................................................................... 32

8.3.

BLE Radio.................................................................................................................................. 32

8.4.

Microchip BluSDK Smart............................................................................................................33

9. External Interfaces...................................................................................................34

9.1.

Overview.................................................................................................................................... 34

9.2.

I2C Master/Slave Interface......................................................................................................... 38

9.3.

SPI Master/Slave Interface.........................................................................................................38

9.4.

SPI Flash Master Interface.........................................................................................................39

9.5.

UART Interface...........................................................................................................................40

9.6.

Analog to Digital Converter (ADC)............................................................................................. 41

9.7.

Software Programmable Timer and Pulse Width Modulator...................................................... 42

9.8.

Clock Output...............................................................................................................................43

9.9.

Three-axis Quadrature Decoder.................................................................................................43

10. Electrical Characteristics......................................................................................... 45

Datasheet Preliminary

DS70005342A-page 3

ATSAMB11XR Fiches technique(PDF) 3 Page - Microchip Technology

ATSAMB11XR Fiches technique(HTML) 3 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87

Fiches technique Télécharger

Lien URL