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AD6676EBZ Fiches technique(PDF) 90 Page - Analog Devices |
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AD6676EBZ Fiches technique(HTML) 90 Page - Analog Devices |
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90 / 90 page ![]() AD6676 Data Sheet Rev. A | Page 90 of 90 OUTLINE DIMENSIONS A B C D E F G H J K 0.660 0.600 0.540 4.33 4.29 4.25 5.08 5.04 5.00 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) SIDE VIEW 0.270 0.240 0.210 0.390 0.360 0.330 0.360 0.320 0.280 4.50 REF 3.50 REF 0.50 BALL PITCH 0.36 0.27 0.43 BALL A1 IDENTIFIER 1 2 3 4 5 6 7 8 COPLANARITY 0.05 SEATING PLANE Figure 151. 80-Ball Wafer Level Chip Scale Package [WLCSP] (CB-80-5) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD6676BCBZRL −40°C to +85°C 80-Ball Wafer Level Chip Scale Package [WLCSP] CB-80-5 AD6676EBZ Evaluation Board 1 Z = RoHS Compliant Part. ©2014–2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12348-0-9/15(A) |
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