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ST72C171 Fiches technique(PDF) 128 Page - STMicroelectronics

No de pièce ST72C171
Description  8-BIT MCU with 8K FLASH, ADC, WDG, SPI, SCI, TIMERS SPGAs Software Programmable Gain Amplifiers, OP-AMP
PDF  152 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72C171 Fiches technique(HTML) 128 Page - STMicroelectronics

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EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to VDD are not implemented. An additional
local protection between the pad and VSS (5a &
5b) is implemented to completly absorb the posi-
tive ESD discharge.
Multisupply Configuration
When several types of ground (VSS, VSSA, ...) and
power supply (VDD, VDDA, ...) are available for any
reason (better noise immunity...), the structure
shown in Figure 80 is implemented to protect the
device against ESD.
Figure 78. Positive Stress on a True Open Drain Pad vs. VSS
Figure 79. Negative Stress on a True Open Drain Pad vs. VDD
Figure 80. Multisupply Configuration
IN
VDD
VSS
(1)
(2b)
(4)
OUT
VDD
VSS
(3b)
Main path
Path to avoid
(5a)
(5b)
IN
VDD
VSS
(1)
(2b)
(4)
OUT
VDD
VSS
(3b)
Main path
(3b)
(3b)
VDDA
VSSA
VDDA
VDD
VSS
BACK TO BACK DIODE
BETWEEN GROUNDS
VSSA



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