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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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AS7038RB Fiches technique(PDF) 11 Page - ams-OSRAM AG |
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AS7038RB Fiches technique(HTML) 11 Page - ams-OSRAM AG |
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11 / 127 page  Document Feedback AS7038RB Absolute Maximum Ratings Datasheet • PUBLIC DS000726 • v2-00 • 2021-Jun-02 126 │ 10 4 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5 Absolute Maximum Ratings of AS7038RB Symbol Parameter Min Max Unit Comments Electrical Parameters VSUP / VGND Supply Voltage to Ground 6 V VIN Input Pin Voltage to Ground pins GPIO0/1/2/3 -0.3 VDD+0.3 (max. 6V) V Diode to VDD VIN-OTHER Input Pin Voltage to Ground pins SCL/SDA/INT/ENABLE and VD1/VD2/VD3/VD4 -0.3 5.5 V No internal diode to VDD or V_LDO VVD1/2/3/4_INTERNAL Voltage between internal pin of VD1- VD4 to VDD VDD+0.3 V Internal diode between current source (internal node at anode of the LED if the pin has a LED otherwise VD1/2/3/4 pin) and VDD VIN-LDO Input Pin Voltage to Ground for pin V_LDO -0.3 2.0 V Diode to VDD VIN-LDO_DIODE Input Pin Voltage to Ground pins for ECG_INP/ECG_INN/ECG_REF/SIGREF -0.3 2.0 V Diode to V_LDO VGND-AGND Analog to power ground voltage difference -0.3 +0.3 V ISCR Input Current (latch-up immunity) ±100 mA JEDEC JESD78 Electrostatic Discharge ESDHBM Electrostatic Discharge HBM ±2 kV ANSI/ESDA/JEDEC JS-001-2012 Temperature Ranges and Storage Conditions TSTRG Storage Temperature Range -40 85 °C TBODY Package Body Temperature 260 °C IPC/JEDEC J-STD- 020 (1) RHNC Relative Humidity (non-condensing) 5 85 % MSL Moisture Sensitivity Level 3 Maximum floor life time of 168h (1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.” The lead finish for Pb- free leaded packages is “Matte Tin” (100 % Sn) |
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