PCF8811USLASH2DASLASH1 datasheet(60/73 Pages) PHILIPS

60 / 73 page

2004 May 17

Philips Semiconductors

Product speciﬁcation

× 128 pixels matrix LCD driver

PCF8811

Table 26 Sequence for OTP programming; note 1

Note

1. X = don’t care.

22.8

Programming speciﬁcation

Table 27 Programming speciﬁcation; see Fig.50

STEP EXT

D/CR/W

ACTION

0011100001

exit power-save

wait 5 ms for refresh to take effect

0010101001

re-enter Power-down (DON = 0)

0010000010

enter CALMM mode

0010

XXXXX

shift in data; MMVOPCAL[4] is ﬁrst

bit

0010

XXXXX

MMVOPCAL[3]

0010

XXXXX

MMVOPCAL[2]

0010

XXXXX

MMVOPCAL[1]

0010

XXXXX

MMVOPCAL[0]

0010

XXXXX

MMTC[2]

0010

XXXXX

MMTC[1]

0010

XXXXX

MMTC[0]

0011

XXXXX

seal bit; remain in CALMM mode

apply programming voltage at pins

VOTPPROG and VLCDIN according to

Section 22.8

Repeat steps 5 to 14 for each bit that should be programmed to 1

apply external reset

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

VOTPPROG

voltage applied to pin VOTPPROG

relative to VSS1

programming active;

note 1

11.0

11.5

12.0

programming inactive;

note 1

VSS − 0.2

+0.2

VLCDIN

voltage applied to pin VLCDIN

relative to VSS1

programming active;

notes 1 and 2

9.5

programming inactive;

notes 1 and 2

VDD2 − 0.2 VDD2

4.5

ILCDIN

current drawn by VLCDIN during

programming

when programming a

single bit to logic 1

−

850

1000

µA

IVOTPPROG

current drawn by VOTPPROG during

programming

−

100

200

µA

Tamb(PROG)

ambient temperature during

programming

025

°C

tSU;SCLK

set-up time of internal data after

last clock

−−µs

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