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MB9BF412R Fiches technique(PDF) 118 Page - SPANSION |
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MB9BF412R Fiches technique(HTML) 118 Page - SPANSION |
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118 / 121 page ![]() DataS h eet February 27, 2015, MB9B410R-DS706-00026-3v0-E 115 CONFIDENTIAL 112-ball plastic PFBGA Ball pitch 0.80 mm Package width × package length 10.00 × 10.00 mm Lead shape Soldering ball Sealing method Plastic mold Ball size Ф 0.45 mm Mounting height 1.45 mm Max. Weight 0.22 g 112-ball plastic PFBGA (BGA-112P-M04) (BGA-112P-M04) C 2003-2010 FUJITSU SEMICONDUCTOR LIMITED B112004S-c-2-3 10.00±0.10(.394±.004) (.049±.008) 1.25±0.20 (Seated height) 6 F INDEX (INDEX AREA) 10.00±0.10 (.394±.004) (112-Ф0.18±.004) 112-Ф0.45±010 0.35±0.10 (.014±.004) (Stand off) 0.10(.004) S B A G H J K LE D C B A 7 8 9 10 11 5 4 3 2 1 0.80(.031) REF REF 0.80(.031) Ф0.08(.003) B A S M 0.20(.008) S B S A S 0.20(.008) Dimensions in mm (inches). Note: The values in parentheses are reference values. |
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