MB9BF412R datasheet(115/121 Pages) SPANSION

No de pièce	MB9BF412R

Description	This document states the current technical specifications regarding

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DataS h eet

112

MB9B410R-DS706-00026-3v0-E, February 27, 2015

CONFIDENTIAL



Package Dimensions

100-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

14.00 mm × 14.00 mm

Lead shape

Gullwing

Lead bend

direction

Normal bend

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.65 g

100-pin plastic LQFP

(FPT-100P-M23)

2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4

16.00±0.20(.630±.008)SQ

125

100

0.50(.020)

0.22±0.05

0.08(.003)

*14.00±0.10(.551±.004)SQ

0.145±0.055

(.006±.002)

0.08(.003)

"A"

INDEX

0°~8°

0.50±0.20

0.10±0.10

(Stand off)

+.008

+0.20

(Mounting height)

-0.10

1.50

.059 -.004

(

)

0.60±0.15

0.25(.010)

Dimensions in mm (inches).

Note:The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

Details of "A" part

(.004±.004)

(.009±.002)

(.020±.008)

(.024±.006)

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