CHR71000 datasheet(51/54 Pages) AMSOSRAM

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CHR71000

Soldering & storage information

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DS000427 • v2-01 • 2026-Mar-18

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Soldering & storage information

Image sensors with filter arrays (CFA) and micro-lens are especially sensitive to high

temperatures. Prolonged heating at elevated temperatures may result in deterioration of the

performance of the sensor. Best solution will be flow soldering or manual soldering of a socket

(through hole or BGA) and plug in the sensor at latest stage of the assembly/test process. The

BGA solution allows more flexibility for the routing of the camera PCB.

11.1

Manual soldering

Use partial heating method and use a soldering iron with temperature control. The soldering

iron tip temperature is not to exceed 350°C with 270°C maximum pin temperature, 2 seconds

maximum duration per pin. Avoid global heating of the ceramic package during soldering.

Failure to do so may alter device performance and reliability.

11.2

Wave soldering

Wave soldering is possible but not recommended. Solder dipping can cause damage to the

glass and harm the imaging capability of the device. See the figure below for the wave

soldering profile.

Figure 29: Wave solder profile

CHR71000 Fiches technique(PDF) 51 Page - ams-OSRAM AG