VD66GY datasheet(33/37 Pages) STMICROELECTRONICS

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9.2

Storage information

Store all packing material in an appropriate indoor area. This is to prevent any dust and/or damage from the sun,

external light, and physical shocks.

Keep the temperature between 15ºC and 35ºC.

Keep the relative humidity range between 10% and 70% maximum.

Store the reconstructed wafers under vacuum, in their original supplied sealed packing until they are used.

After the packing seal is broken, store the reconstructed wafers under nitrogen (N2) within dedicated closed

shelves until they are processed.

Use the trace code to count the storage time. It is written on the package label.

The maximum storage time of the reconstructed wafer is:

•

Six months from the trace code date. This is when the wafer is kept in the original sealed packing.

•

One week from the trace code date. This is when the original packing seal is open.

The maximum storage time defines the maximum time that can be waited for reconstructed wafer processing.

Processing may be for picking and placing, and module integration. If the maximm storage time is not respected,

safe processing is not guaranteed.

Note:

For further information on reconstructed wafer specifications for visual inspection and packing, refer to the

technical note TN1497.

VD66GY

Package information

DS13838 - Rev 7

page 33/37

VD66GY Fiches technique(PDF) 33 Page - STMicroelectronics