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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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VD66GY Fiches technique(PDF) 32 Page - STMicroelectronics |
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VD66GY Fiches technique(HTML) 32 Page - STMicroelectronics |
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32 / 37 page  9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9.1 Packing Tested dice are delivered as sawn dice which are reconstructed into a wafer format on UV-tape, and delivered on a metallic ring (see figure below). The frames are packed in plastic containers, each including a maximum of 13 double-spaced reconstructed wafer rings. A mapping information file is also provided for localizing dice that may have been damaged during wafer reconstruction on sticking foil. Figure 21. Reconstructed wafer information VD66GY Package information DS13838 - Rev 7 page 32/37 |
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