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KTS1675 Fiches technique(PDF) 3 Page - Kinetic Technologies. |
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KTS1675 Fiches technique(HTML) 3 Page - Kinetic Technologies. |
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3 / 22 page ![]() KTS1675 August 2020 - Revision 04e Page 3 Company Confidential Absolute Maximum Ratings1 (TA = 25°C unless otherwise noted) Symbol Description Value Units IN Input Voltage -0.3 to 28 V OUT Output Voltage -0.3 to 24 V IN-OUT IN to OUT Voltage (when OFF) -24 to 28 V VSNS Input Voltage Sensing 20 V EN ̅̅̅̅, FLAG ̅̅̅̅̅̅̅̅, WRX ̅̅̅̅̅̅̅ EN ̅̅̅̅, FLAG ̅̅̅̅̅̅̅̅ and WRX ̅̅̅̅̅̅̅ pins -0.3 to 6 V IN, OUT Current Continuous Current 5 A TJ Operating Junction Temperature Range -40 to 150 °C Ts Storage Temperature Range -65 to 150 °C TLEAD Maximum Soldering Temperature (at leads, 10 sec) 260 °C Thermal Capabilities Symbol Description Value Units θJA Thermal Resistance – Junction to Ambient2 65 °C/W PD Maximum Power Dissipation at TA ≤ 25°C 1919 mW ΔPD/ΔT Derating Factor Above TA = 25°C -15.4 mW/°C Ordering Information Part Number Marking Operating Temperature Package KTS1675EUT-TR MOXXYYZZZZ3 -40°C to +85°C WLCSP-20 Recommended Operating Condition4 Description Value IN Voltage Range 3.0V to 20V OUT Voltage Range 3.0V to 18V Ambient Temperature -40°C to +85°C Input capacitance (CIN) Up to 10 F OTG hot swap capacitance (COTG) Up to 200 F Output capacitance (COUT) Up to 20 F 1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one time. 2. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the device when soldered to a 4-layer board. 3. XX = Date Code, YY = Assembly Code, ZZZZ = Serial Number. 4. The device is not guaranteed to function outside of recommended operating condition. |
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