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HCS08 Fiches technique(PDF) 286 Page - NXP Semiconductors

No de pièce HCS08
Description  Microcontrollers
PDF  316 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

HCS08 Fiches technique(HTML) 286 Page - NXP Semiconductors

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Appendix A Electrical Characteristics
MC9S08SG8 MCU Series Data Sheet, Rev. 8
286
Freescale Semiconductor
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD  JA)
Eqn. A-1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD  VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O  Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K  (TJ + 273C)
Eqn. A-2
Solving Equation A-1 and Equation A-2 for K gives:
K = PD  (TA + 273C) + JA  (PD)
2
Eqn. A-3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving Equation A-1 and Equation A-2 iteratively for any value of TA.



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