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STMPE811 Fiches technique(PDF) 52 Page - STMicroelectronics |
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STMPE811 Fiches technique(HTML) 52 Page - STMicroelectronics |
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52 / 54 page ![]() Package mechanical data STMPE811 52/54 16 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 12. QFN16L (3 x 3 mm) package outline 1. Drawing not to scale. Table 25. QFN16 (3 x 3 mm) package mechanical data Symbol millimeters inches Min Typ Max Min Typ Max A 0.80 0.90 1.00 0.032 0.035 0.039 A1 0.02 0.05 0.001 0.002 A3 0.20 0.008 b 0.18 0.25 0.30 0.007 0.010 0.012 D3.00 0.118 D2 1.55 1.70 1.80 0.061 0.067 0.071 E3.00 0.118 E2 1.55 1.70 1.80 0.061 0.067 0.071 e0.50 0.020 K0.20 0.008 L 0.30 0.40 0.50 0.012 0.016 0.020 r0.09 0.006 E A A1 e K E2 b r D2 K L A3 D |
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