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M36DR232B Fiches technique(PDF) 41 Page - STMicroelectronics |
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M36DR232B Fiches technique(HTML) 41 Page - STMicroelectronics |
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41 / 46 page ![]() 41/46 M36D232A, M36DR232B Table 34. Ordering Information Scheme Devices are shipped from the factory with the memory content bits erased to ’1’. Table 35. Daisy Chain Ordering Scheme For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de- vice, please contact the STMicroelectronics Sales Office nearest to you. Example: M36DR232A 100 ZA 6 T Device Type M36 = MMP (Flash + SRAM) Architecture D = Dual Bank, Page Mode Operating Voltage R=VDDF =VDDS =1.65V to 2.2V SRAM Chip Size & Organization 2 = 2 Mbit (256K x 16 bit) Device Function 32A = 32 Mbit (x16), Dual Bank: 1/8-7/8 partitioning, Top Boot 32B = 32 Mbit (x16), Dual Bank: 1/8-7/8 partitioning, Bottom Boot Speed 100 = 100ns 120 = 120ns Package ZA = LFBGA66: 0.8mm pitch Temperature Range 6= –40to 85°C Option T = Tape & Reel packing C = Cypress’s SRAM Example: M36DR232 -ZA T Device Type M36DR232 Daisy Chain -ZA = LFBGA66: 0.8mm pitch Option T = Tape & Reel Packing |
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