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L99PM72PXP Fiches technique(PDF) 52 Page - STMicroelectronics |
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L99PM72PXP Fiches technique(HTML) 52 Page - STMicroelectronics |
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52 / 128 page ![]() Electrical specifications L99PM72PXP 52/128 Doc ID 023553 Rev 3 5.4 Package and PCB thermal data 5.4.1 PowerSSO-36 thermal data Figure 27. PowerSSO-36 PC board Note: Layout condition of Rth and Zth measurements (board finish thickness 1.6 mm +/- 10% board double layer, board dimension 129x60, board Material FR4, Cu thickness 0.070 mm (front and back side), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm). |
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