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DRV8317 Fiches technique(PDF) 65 Page - Texas Instruments |
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DRV8317 Fiches technique(HTML) 65 Page - Texas Instruments |
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65 / 69 page ![]() www.ti.com PACKAGE OUTLINE C 36X 0.25 0.15 2.8 2.6 36X 0.5 0.3 0.8 MAX (0.1) TYP 0.05 0.00 32X 0.4 2X 3.6 3.8 3.6 2X 2.8 4X (0.41) A 4.1 3.9 B 5.1 4.9 WQFN - 0.8 mm max height REE0036A PLASTIC QUAD FLATPACK - NO LEAD 4226725/A 04/2021 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 10 19 28 11 18 36 29 PIN 1 ID 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SYMM SYMM SCALE 3.300 www.ti.com DRV8317 SLVSGT3 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 65 Product Folder Links: DRV8317 |
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