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PC87366 Fiches technique(PDF) 208 Page - National Semiconductor (TI) |
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PC87366 Fiches technique(HTML) 208 Page - National Semiconductor (TI) |
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208 / 240 page ![]() 12.0 Temperature Sensor (TMS) (Continued) 208 www.national.com • Keep in mind that copper cannot be used as an EMI shield, and only ferrous materials such as steel work well. Placing a copper ground plane between the DXP-DXN traces and traces carrying high frequency noise signals does not help reduce EMI. Figure 45. DXP/DXN PC Traces Figure 46. Typical Operating Circuit DXP GND GND DXN 10 mil Minimum 10 mil 10 mil 10 mil 2N3904 2200 pF DXP DXN |
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