A14100A-RQ208C datasheet(16/68 Pages) ACTEL

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Package Thermal Characteristics

The device junction to case thermal characteristic is

θjc, and

the junction to ambient air characteristic is

θja. The thermal

characteristics for

θja are shown with two different air flow

rates.

Maximum junction temperature is 150

°C.

A sample calculation of the absolute maximum power

dissipation allowed for a CPGA 175-pin package at

commercial temperature and still air is as follows:

Power Dissipation

P = [ICC standby+ Iactive] * VCC + IOL * VOL * N + IOH *

(VCC – VOH) * M

(1)

Where:

ICC standby is the current flowing when no inputs or

outputs are changing.

Iactive is the current flowing due to CMOS switching.

IOL, IOH are TTL sink/source currents.

VOL, VOH are TTL level output voltages.

N equals the number of outputs driving TTL loads to

VOL.

M equals the number of outputs driving TTL loads to

VOH.

An accurate determination of N and M is problematical

because their values depend on the design and on the system

I/O. The power can be divided into two components: static

and active.

Static Power Component

Actel FPGAs have small static power components that result

in lower power dissipation than PALs or PLDs. By integrating

multiple PALs/PLDs into one FPGA, an even greater

reduction in board-level power dissipation can be achieved.

The power due to standby current is typically a small

component of the overall power. Standby power is calculated

below for commercial, worst case conditions.

The static power dissipated by TTL loads depends on the

number of outputs driving high or low and the DC load

current. Again, this value is typically small. For instance, a

32-bit bus sinking 4 mA at 0.33 V will generate 42 mW with all

outputs driving low, and 140 mW with all outputs driving high.

The actual dissipation will average somewhere between as

I/Os switch states with time.

Package Type1

Pin Count

θjc

θja

Still Air

θja

300 ft/min

Units

Ceramic Pin Grid Array

100

133

175

207

257

°C/W

Ceramic Quad Flatpack

132

196

256

°C/W

Plastic Quad Flatpack

100

160

208

°C/W

Very Thin Quad Flatpack

100

°C/W

Thin Quad Flatpack

176

°C/W

Power Quad Flatpack

208

0.4

°C/W

Plastic Leaded Chip Carrier

°C/W

Plastic Ball Grid Array

225

313

°C/W

Note:

Maximum Power Dissipation in Still Air for 160-pin PQFP package is 2.4 Watts, 208-pin PQFP package is 2.4 Watts, 100-pin PQFP package

is 1.6 Watts, 100-pin VQFP package is 1.9 Watts, 176-pin TQFP package is 2.5 Watts, 84-pin PLCC package is 2.2 Watts, 208-pin RQFP

package is 4.7 Watts, 225-pin BGA package is 3.2 Watts, 313-pin BGA package is 3.5 Watts.

Absolute Maximum Power Allowed

Max. junction temp. (

°C) – Max. ambient temp. (°C)

θja (°C/W)

------------------------------------------------------------------------------------------------------------------------------

150

°C – 70°C

°C/W

---------------------------------

3.2 W

ICC

VCC

Power

2mA

5.25 V

10.5 mW

A14100A-RQ208C Fiches technique(PDF) 16 Page - Actel Corporation

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