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STM32F103XC Fiches technique(PDF) 9 Page - STMicroelectronics

No de pièce STM32F103XC
Description  Performance line, ARM-based 32-bit MCU with up to 512 KB Flash, USB, CAN, 11 timers, 3 ADCs and 13 communication interfaces
PDF  118 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103XC Fiches technique(HTML) 9 Page - STMicroelectronics

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STM32F103xC, STM32F103xD, STM32F103xE
Description
9/118
2.1
Device overview
Table 2.
STM32F103xC, STM32F103xD and STM32F103xE features and peripheral
counts
Peripherals
STM32F103Rx
STM32F103Vx
STM32F103Zx
Flash memory in Kbytes
256
384
512
256
384
512
256
384
512
SRAM in Kbytes
48
64
48
64
48
64
FSMC
No
Yes
Yes
Timers
General-
purpose
4
Advanced-
control
2
Basic
2
Comm
SPI(I2S)(1)
1.
The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the
I2S audio mode.
3(2)
I2C2
USART
5
USB
1
CAN
1
SDIO
1
GPIOs
51
80
112
12-bit ADC
Number of channels
3
16
3
16
3
21
12-bit DAC
Number of channels
1
2
CPU frequency
72 MHz
Operating voltage
2.0 to 3.6 V
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 9)
Junction temperature: –40 to + 125 °C (see Table 9)
Package
LQFP64
LQFP100(2), BGA100
2.
For the LQFP100 and BGA100 packages, only FSMC Bank1 and Bank2 are available. Bank1 can only
support a multiplexed NOR Flash memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-
bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not
available in this package.
LQFP144, BGA144



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