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ADIS16501/PCBZ Fiches technique(PDF) 7 Page - Analog Devices

No de pièce ADIS16501/PCBZ
Description  Precision, MEMS IMU
PDF  45 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADIS16501/PCBZ Fiches technique(HTML) 7 Page - Analog Devices

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Data Sheet
ADIS16501
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. B | 7 of 45
Table 3.
Parameter
Rating
Mechanical Shock Survivability
Any Axis, Unpowered, 0.5 ms
1500 g
VDD to GND
−0.3 V to +3.6 V
Digital Input Voltage to GND
−0.3 V to VDD + 0.2 V
Digital Output Voltage to GND
−0.3 V to VDD + 0.2 V
Storage Temperature Range
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
The ADIS16501 is a multichip module that includes many active
components. The values in Table 4 identify the thermal response of
the hottest component inside of the ADIS16501, with respect to the
overall power dissipation of the module. This approach enables a
simple method for predicting the temperature of the hottest junction,
based on either ambient or case temperature.
For example, when the ambient temperature is 70°C, the hottest
junction temperature (TJ) inside of the ADIS16501 is 76.7°C.
TJ = θJA × VDD × IDD + 70°C
TJ = 107.1°C/W × 3.3 V × 0.044 A + 70°C
TJ = 85.6°C
Table 4. Package Characteristics
Package Type
θJA1
θJC2
Device Weight
ML-100-13
107.1°C/W
74.7°C/W
<1.3 g
1 θJA is the natural convection junction to ambient thermal resistance measured
in a one cubic foot sealed enclosure.
2 θJC is the junction to case thermal resistance.
3 Thermal impedance values come from direct observation of the hottest temper-
ature inside of the ADIS16501 when it is attached to an FR4-08 PCB that has
two metal layers and has a thickness of 0.063 inches.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.



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