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L6364 Fiches technique(PDF) 59 Page - STMicroelectronics

No de pièce L6364
Description  Dual channel transceiver IC for SIO and IO-Link sensor applications
PDF  60 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6364 Fiches technique(HTML) 59 Page - STMicroelectronics

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List of figures
Figure 1.
Block Diagram .................................................................... 3
Figure 2.
Package and pin-out - QFN ........................................................... 4
Figure 3.
Package and pin-out - CSP ........................................................... 4
Figure 4.
Example of Wake-up sequence timing (VCQ = green plot; ICQ = red plot; VINT = Yellow) .................. 8
Figure 5.
Register programming. ............................................................. 12
Figure 6.
Single byte and sequential byte accesses ................................................ 13
Figure 7.
IO-Link UART peripheral state machine .................................................. 17
Figure 8.
Single octet UART mode state diagram .................................................. 21
Figure 9.
Illustration of operation in transparent mode ............................................... 22
Figure 10.
Wake-up time diagram.............................................................. 29
Figure 11.
L6364 temperature measurement ...................................................... 33
Figure 12.
L6364 thermal shutdown configuration................................................... 34
Figure 13.
L6364 LED currents ............................................................... 35
Figure 14.
Block diagram of DC-DC converter ..................................................... 37
Figure 15.
Minimum supply voltage ............................................................ 38
Figure 16.
Overcurrent operation .............................................................. 39
Figure 17.
L6364 linear regulators' startup under different conditions of load capacitance ....................... 40
Figure 18.
Example of thermal power dissipation estimation ........................................... 41
Figure 19.
Surge waveform .................................................................. 42
Figure 20.
Detailed block diagram, showing register field connections..................................... 46
Figure 21.
Application example: DC-DC disabled, CQ and DIO coupled (Join Mode), VSENSOR = 5 V, VMCU = VDIG = 3.3 V
.............................................................................. 47
Figure 22.
Application example: DC-DC enabled, CQ and DIO coupled (Join Mode), VSENSOR = VMCU = VDIG = 5.0 V .. 47
Figure 23.
Application example: DC-DC disabled, CQ as line driver, DIO as load driver, VSENSOR = 5.0 V, VMCU = VDIG = 3.3
V ............................................................................ 48
Figure 24.
Application example: DC-DC enabled, CQ and DIO as independent line drivers, VSENSOR > 5.0 V, VMCU = VDIG =
5.0 V ......................................................................... 48
Figure 25.
QFN20L mechanical drawings ........................................................ 49
Figure 26.
QFN20L Suggested footprint ......................................................... 50
Figure 27.
QFN20L, Packing information (drawing and dimension [mm]) ................................... 50
Figure 28.
CSP19 Mechanical drawings ......................................................... 52
Figure 29.
CSP19 Suggested footprint .......................................................... 53
Figure 30.
CSP19, Packing Information (drawing and dimension [mm]) .................................... 53
L6364
List of figures
DS13363 - Rev 4
page 59/60



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