FXLS8967AF datasheet(87/98 Pages) NXP

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NXP Semiconductors

FXLS8967AF

3-Axis Low-g Accelerometer

17.2 Lead dimension detail

The width of lead end as viewed from leaded side of package has minimum dimension of

0.125 mm. The maximum dimension is equal to lead width at the bottom surface of the

package as indicated on the drawing.

aaa-040850

LEADED SIDE VIEW

BOTTOM VIEW

MAX = A

0.125 MIN

Figure 28. Bottom and leaded view dimensions

17.3 Burr specification

The assembly site specifies burrs to 0.076 mm maximum.

18 Soldering information

18.1 Printed circuit board layout and device mounting

Printed circuit board (PCB) layout and device mounting are critical to the overall

performance of the design. The footprint for the surface mount packages must be the

correct size as a base for a proper solder connection between the PCB and the package.

The correct size of the surface mount package footprint, along with the recommended

soldering materials and techniques, optimize assembly and minimize the stress on the

package after board mounting.

NXP application note AN1902[1] discusses the DFN package used by the FXLS8967AF.

18.1.1 Overview of soldering considerations

The information provided here is based on experiments executed on QFN devices. They

do not represent exact conditions present at a customer site. Therefore, information

herein should be used as guidance only, and process and design optimizations are

recommended to develop an application-specific solution. It should be noted that with the

proper PCB footprint and solder stencil designs, the package self-aligns during the solder

reflow process.

18.1.2 Halogen content

This package is Halogen free, exceeding most industry and customer standards.

Halogen Free means that no homogeneous material within the assembly package shall

contain chlorine (Cl) in excess of 700 ppm or 0.07 % weight/weight or bromine (Br) in

excess of 900 ppm or 0.09 % weight/weight.

FXLS8967AF

All information provided in this document is subject to legal disclaimers.

Objective data sheet

Rev. 1 — 27 April 2021

87 / 98

FXLS8967AF Fiches technique(PDF) 87 Page - NXP Semiconductors