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FXLS8967AF Fiches technique(PDF) 44 Page - NXP Semiconductors |
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FXLS8967AF Fiches technique(HTML) 44 Page - NXP Semiconductors |
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44 / 98 page ![]() NXP Semiconductors FXLS8967AF 3-Axis Low-g Accelerometer Field Description 7 RST The RST bit may be used to initiate a software reset. The reset mechanism can be triggered in Standby, Active (WAKE or SLEEP), and EXT_TRIG operating modes. When the RST bit is set, the boot mechanism resets all functional blocks and loads the internal registers with their default values (The INT_POL, INT_PP_OD, and BOOT_DIS bits are not reset and maintains their current values as long as power is not removed from the VDD pin and Hibernate mode is not enabled). The host application should allow TBOOT1 or TBOOT2 ms between issuing a reset command and attempting communications with FXLS8967AF over the I2C/SPI interfaces. Alternatively, the host can wait for the active edge on the TBOOT1/2 pulse event signaled on the configured INTx pin. 0: No device reset pending 1: Write '1' to trigger the soft reset sequence Notes: • The I2C and SPI interface blocks are also reset to avoid corrupted data transactions. • The reset sequence does not start until the host I2C controller issues the SP (stop) condition, or the SPI primary releases the SPI_CS_B pin. • The host always reads back this bit as '0'. • There is a delay of 300 μs to 500 μs between setting the RST bit and the commencement of the reset sequence. 6 to 5 ST_AXIS_SEL[1:0] Self-test axis selection This bit field selects the transducer axis to test using the Self-Test function. The ST_POL bit allows either positive or negative self-test displacements to be applied. The host system may use the self-test function to verify the functionality of both the transducer and signal measurement chain without the need to apply an external acceleration stimulus. Notes: • The data output from the two axes that are not selected by ST_AXIS_SEL during the self-test sequence are not meaningful and should be ignored. • NXP recommends minimizing the communication traffic on the device serial interface during the measurement phase in order to reduce the susceptibility of the self-test response signal to induced noise. NXP strongly recommends operating the self-test in interrupt mode. 00b: (default): Self-test function is disabled 01b: Self-test function is enabled for X-axis 10b: Self-test function is enabled for Y-axis 11b: Self-test function is enabled for Z-axis 4 ST_POL Self-test displacement polarity 0 (default): Proof mass displacement for the selected axis is in the positive direction. 1: Proof mass displacement for the selected axis is in the negative direction. 3 SPI_M SPI interface mode selection; selects between 3- and 4-wire operating modes for the SPI interface: 0 (default): 4-wire interface mode is selected 1: 3-wire interface mode is selected Notes: • The state of this bit is only relevant when the SPI interface mode is selected (INTF_SEL = VDD). • When INTF_SEL = VDD and SPI_M = 1, the SDA/SPI_MOSI pin becomes the bidirectional SPI_DATA pin; the SA0/MISO pin is unused and placed in a high-impedance state. • 4-wire mode is selected by default after a POR/BOR event or when exiting Hibernate mode. • If INTF_SEL = VDD and the SPI_MOSI and SPI_MISO lines are directly connected together on the PCB, 3-wire SPI mode is enabled regardless of the setting of this bit Table 48. SENS_CONFIG1 register (address 15h) bit description FXLS8967AF All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Objective data sheet Rev. 1 — 27 April 2021 44 / 98 |
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