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MFRC522 Fiches technique(PDF) 85 Page - NXP Semiconductors |
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MFRC522 Fiches technique(HTML) 85 Page - NXP Semiconductors |
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85 / 96 page ![]() MFRC522_33 © NXP B.V. 2009. All rights reserved. Product data sheet PUBLIC Rev. 3 — 26 October 2009 112133 85 of 96 NXP Semiconductors MFRC522 Contactless reader IC 17. Package outline Fig 33. Package outline SOT617-1 (HVQFN32) 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.1 4.9 Dh 3.25 2.95 y1 5.1 4.9 3.25 2.95 e1 3.5 e2 3.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT617-1 MO-220 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT617-1 HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 916 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area terminal 1 index area 01-08-08 02-10-18 1/2 e 1/2 e A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
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