B32521 datasheet(35/44 Pages) EPCOS

35 / 44 page

Immersion depth

2.0 +0/ 0.5 mm from capacitor body or seating plane

Shield

Heat-absorbing board, (1.5

±0.5) mm thick, between

capacitor body and liquid solder

Evaluation criteria:

Visual inspection

No visible damage

ΔC/C

2% for MKT/MKP/MFP

5% for EMI suppression capacitors

tan

As specified in sectional specification

1.3

General notes on soldering

Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-

gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit

can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical

characteristics. For short exposures (as in practical soldering processes) the heat load (and thus

the possible effects on a capacitor) will also depend on other factors like:

Pre-heating temperature and time

Forced cooling immediately after soldering

Terminal characteristics:

diameter, length, thermal resistance, special configurations (e.g. crimping)

Height of capacitor above solder bath

Shadowing by neighboring components

Additional heating due to heat dissipation by neighboring components

Use of solder-resist coatings

B32520 ... B32529

General purpose (stacked/wound)

Page 35 of 44

Please read Cautions and warnings and

Important notes at the end of this document.

B32521 Fiches technique(PDF) 35 Page - EPCOS