More recent package solution introductions have

begun to utilize an alternative flip chip interconnect

technique called Thermal Compression Non-Conductive

Paste (TCNCP). Rather than a two step solder-then-

underfill process, TCNCP accomplishes both in a single

step. Solder tipped, non-melting Cu pillar bumps are

pushed through a liquid epoxy underfill, then heat is

applied to both form a metallurgical bond and cure

the epoxy. The use of TCNCP + Cu pillar allows for finer

bump pitch geometries by maintaining standoff and

reducing shorting issues.

Wafer Bumping Technology

In support of flip chip assembly, Amkor has established

wafer bumping production lines within their Korea,

Taiwan, Portugal and China manufacturing facilities.

Amkor’s bumping is based on its proprietary

electroplating solder technology which is considered

the most advanced, robust, reliable and high yielding

process available in the marketplace. Eutectic Sn/Pb,

Pb-free (98.2% Sn/1.8% Ag) and Cu pillar bumping are

all available in volume production on 200 mm and 300

mm wafers.

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Wafer sizes from 200 mm to 300 mm diameter

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Full area array pitch available to 130 µm – perimeter

pad pitch to <100 µm

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Cu Pillar, eutectic Sn/Pb and Pb-free (98.2Sn/1.8Ag)

compositions available

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Low alpha (<0.02 cph) and ultra-low alpha (<0.002

cph) solders available

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Polyimide repassivation available

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Redistribution layer using plated Cu available

Packaging Options Using Flip Chip

Depending on the specific die and application

requirements, different package level solutions are

required. Thus flip chip interconnect can be used in

a wide range of package solutions, each focused on

specific benefits that serve a given market. Amkor

offers the widest possible range of flip chip packaging

solutions to meet the diverse needs of customers and

end users. Combining their extensive manufacturing

knowledge with all types of packaging interposers and

further leveraging their leadership role in flip chip

interconnect technology, Amkor continues to pursue

new package solutions.

Bare die FCBGA cross section

Single piece lid FCBGA cross section

Flip Chip BGA Package

Amkor FCBGA packages are assembled around state-

of-the-art, single unit laminate or ceramic substrates.

Utilizing multiple high density routing layers, laser

drilled blind, buried, and stacked vias, and ultra fine

line/space metallization, FCBGA substrates have the

highest routing density available. By combining flip chip

interconnect with ultra advanced substrate technology,

FCBGA packages can be electrically tuned for maximum

electrical performance. Once the electrical function

is defined, the design flexibility enabled by flip chip

also allows for significant options in final package

design. Amkor offers FCBGA packaging in a variety of

product formats to fit a wide range of end application

requirements.

The variety of FCBGA package options allows package

selection to be tailored to the specific thermal needs

of the end product. High performance ASIC products

typically utilize a lidded format that features a

controlled bondline die attach direct to a copper heat

spreader. This feature produces the lowest possible

thermal resistance (Theta JC) between the package and

any externally applied thermal solution. The copper

heat spreader effectively spreads heat laterally away

from the die to the package perimeter and into the

motherboard.

Lower wattage products generally utilize bare die or

molded configurations. In these cases, the flip chip

construction, with solder bumps and core vias, provides

a lower resistance path from the active side of the die

through the substrate, allowing heat dissipation both

from the package surface and into the motherboard.

This IC packaging technology is applicable for high

pin count and/or high performance ASICs. Large body

FCBGAs provide package solutions for the demands of

internet, workstation processors and high bandwidth

system communication devices. By incorporating flip

chip interconnect technology, packages supporting

thousands of connections are enabled in conventional

surface mount package sizes. FCBGAs are also the

package of choice for gaming system processors and

graphics, as well as high-end applications processors

for leading-edge portable devices.

Package Options

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Wafer node: ≥7 nm qualified (5 nm in development)

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SMT components on top or bottom side

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Multi-die capability

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Memory components on top side

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Variety of lid material options

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Grounded lid

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Custom BGA footprints