FCIP Fiches technique(PDF) - Amkor Technology

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FCIP Fiches technique (PDF) - Amkor Technology

FCIP Datasheet PDF - Amkor Technology


No de pièce	FCIP

Télécharger	FCIP Télécharger

Taille du fichier	1242.94 Kbytes

Page	4 Pages

Fabricant	AMKOR [Amkor Technology]

Site Internet	http://www.amkor.com

Logo

Description

Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.

FCIP Datasheet (PDF)

Go To PDF Page

Télécharger Fiches technique

FCIP Datasheet PDF - Amkor Technology


No de pièce	FCIP

Télécharger	FCIP Click to download

Taille du fichier	1242.94 Kbytes

Page	4 Pages

Fabricant	AMKOR [Amkor Technology]

Site Internet	http://www.amkor.com

Logo

Description	Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.

FCIP Fiches technique (HTML) - Amkor Technology

FCIP Datasheet HTML 1Page - Amkor Technology

FCIP Datasheet HTML 2Page - Amkor Technology

FCIP Datasheet HTML 3Page - Amkor Technology

FCIP Datasheet HTML 4Page - Amkor Technology

FCIP Détails du produit

Features
Incorporates standard JEDEC pitches and CSP solder ball diameters
Compatible with standard SMT assembly and test techniques
Utilizes cost-effective thin film redistribution technologies
Backside laser mark compatible
No need for underfill in most applications
Full turnkey CSPnl processing including test and tape & reel support
Eutectic lead-free solder balls
Available with polyimide repassivation
Qualified and in volume production
Proven reliability; exceeds all current handset mechanical reliability tests including drop, bend and key punch

Numéro de pièce similaire - FCIP

Fabricant	No de pièce	Fiches technique	Description
Turck, Inc.	FCI-1/4TCD04A4P-LIX-H1141	137Kb / 2P	Flow Monitoring – Inline Sensor with Integrated Processor 11/07/2023
Gamewell-FCI by Honeywe...	FCI-CR-D4B	59Kb / 1P	Door, lock & key
Gamewell-FCI by Honeywe...	FCI-CR-D4BR	59Kb / 1P	Door, lock & key
Turck, Inc.	FCI-D03A4-NA-H1141/M16	102Kb / 1P	Flow Monitoring – Inline Sensor without Integrated Processor 11/07/2023
Turck, Inc.	FCI-D04A4P-AP8X-H1141	1Mb / 2P	Flow Monitoring – Inline Sensor with Integrated Processor 11/07/2023

Description similaire - FCIP

Fabricant	No de pièce	Fiches technique	Description
CITIZEN ELECTRONICS CO....	CM155	134Kb / 2P	Being of the ultra-miniature SMD type
PHOENIX CONTACT	2908786	49Kb / 2P	Inexpensive as a result of reducing the number of separate housing parts
	2959298	56Kb / 3P	Inexpensive as a result of reducing the number of separate housing parts
	2959340	50Kb / 2P	Inexpensive as a result of reducing the number of separate housing parts
	2959476	49Kb / 2P	Inexpensive as a result of reducing the number of separate housing parts
SHENZHEN REFOND OPTOELE...	A19A-W2SS1612-C8	1Mb / 23P	The white light of this light emitting diode is formed by mixing light from a blue light chip
	A19A-W2SS2312-C7	1Mb / 23P	The white light of this light emitting diode is formed by mixing light from a blue light chip
	A19A-W2SS3913-C7	1Mb / 23P	The white light of this light emitting diode is formed by mixing light from a blue light chip
	A28B-W2SS4712-C7	1Mb / 23P	The white light of this light emitting diode is formed by mixing light from a blue light chip
	RT-C13A-W2ET0412-P6	2Mb / 23P	The white light of this light emitting diode is formed by mixing light from a blue light chip Size

À propos de Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Ces informations sont fournies à titre informatif uniquement, nous ne serons pas responsables des pertes ou dommages causés par les informations ci-dessus.

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