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SAM9X75-SIP Fiches technique(PDF) 25 Page - Microchip Technology |
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SAM9X75-SIP Fiches technique(HTML) 25 Page - Microchip Technology |
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25 / 36 page ![]() SAM9X75 SiP Mechanical Characteristics Data Sheet © 2023 Microchip Technology Inc. and its subsidiaries DS60001827B - 25 7. Mechanical Characteristics 7.1 243-Ball TFBGA Mechanical Characteristics B A 0.15 C 0.15 C 0.15 C A B 0.08 C 2X TOP VIEW BOTTOM VIEW 2X For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 243-Ball Thin Fine-Pitch Ball Grid Array (4TB) - 16x16x1.23 mm Body [TFBGA] © 2022 Microchip Technology Inc. Sheet 1 of 2 Microchip Technology Drawing C04-21556 Rev B NOTE 1 C END VIEW 0.20 C 0.10 C 243X SEATING PLANE A B C D E F G H J K L M N P R T U 1 3 5 7 9 111315 17 2 4 6 8 10 12 14 16 A B C D E F G H J K L M N P R T U 1 3 5 7 9 111315 17 2 4 6 8 10 12 14 16 D E E1 243X Øb e D1 A1 M A |
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