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AS7261 Fiches technique(PDF) 41 Page - OSRAM GmbH |
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AS7261 Fiches technique(HTML) 41 Page - OSRAM GmbH |
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41 / 48 page ![]() Page 40 ams Datasheet Document Feedback [v1-00] 2016-Dec-30 AS7261 − Soldering & Storage Information Floor Life The CS package has been assigned a moisture sensitivity level of MSL 2. As a result, the floor life of devices removed from the moisture barrier bag is 1 year from the time the bag was opened, provided that the devices are stored under the following conditions: • Floor Life: 1 year • Ambient Temperature: <30°C • Relative Humidity:<60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours. |
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