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DS20005584B-page 5

MIC4600

Timing Diagram

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Maximum Junction Temperature

TJ

—

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 10 sec.

Junction Operating Temperature

TJ

–40

—

+125

°C

—

Storage Temperature Range

—

–65

—

+150

°C

—

Package Thermal Resistance

Thermal Resistance, 3x3 QFN-16Ld

θJA

—59

—

°C/W

—

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

HS

DH

DL

HSI

LSI

t

DEADTIME

t

R

t

F

90%

90%

10%

10%

10%

t

HPLH

t

HPHL

90%

t

PW

t

LPLH

t

LPHL