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MF4SAM3 Fiches technique(PDF) 4 Page - NXP Semiconductors |
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MF4SAM3 Fiches technique(HTML) 4 Page - NXP Semiconductors |
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4 / 31 page ![]() NXP Semiconductors MF4SAM3 MIFARE SAM AV3 secure access module MF4SAM3 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved. Product short data sheet Rev. 3.0 — 2 August 2019 COMPANY PUBLIC 561930 4 / 31 3 Ordering information Table 1. Ordering information Package Type number Name Description Version MF4SAM3X84/9BA6AU PCM1.5 contact chip card module (super 35 mm tape format, 8 contact), minimum order quantity: 11.900 SOT658-1 MF4SAM3X84/9BA6AUS PCM1.5 contact chip card module (super 35 mm tape format, 8 contact), minimum order quantity: 1.000 SOT658-1 MF4SAM3HN/9BA6AU HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm; reel pack; minimum order quantity: 6.000 SOT617-3 MF4SAM3U15/9BA6AU wafer 150 mm thickness sawn wafer on film frame carrier (FFC) NAU000 |
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