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STM32469VG Fiches technique(PDF) 213 Page - STMicroelectronics |
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STM32469VG Fiches technique(HTML) 213 Page - STMicroelectronics |
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213 / 220 page ![]() DS11189 Rev 7 213/220 STM32F469xx Package information 217 Figure 99. TFBGA216 - Recommended footprint ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to four decimal digits. Table 122. TFBGA216 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max Table 123. TFBGA216 - Recommended PCB design rules (0.8 mm pitch) Dimension Recommended values Pitch 0.8 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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