Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Jan., 2018

www.anpec.com.tw

2

APX9359A

S ymbol

Pa ram ete r

Rating

Unit

VCC P in Supp ly Voltage (V CC to GND)

-0.3 to 7

V

UO /V O/W O Pin Ou tpu t Curren t

1

A

UO /V O/W O Pin Ou tpu t Voltage

-0.3 to 7

V

PWM/V SP Pin Maximum Inp ut Voltage

-0.3 to 7

V

SO Pin O utput Voltage

-0.3 to 7

V

I

SO

SO Pin Maximum Output Sink Current

10

mA

Ju nctio n Temp erature

-40 to 150

o

C

Sto rage Temperature

-65 to 150

o

C

Ma xim um Le ad So lderin g Tempe ratu re (10 Se co nds)

26 0

Note 1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Thermal Characteristics

S ymbol

Pa ram ete r

Typica l Value

Unit

Th ermal Resistan ce -Ju nctio n to A mbient

(Note 2)

VTDFN2x2 -10

10 4

VTDFN2x2 -10

1 .2

W

Note 2:

θ

JA

is measured on a board (30x30x1.2mm, Glass epoxy). The Thermal Pad on the bottom of VTDFN2x2-10 package should

soldered directly to the PCB

’s Thermal Pad area that with several thermal vias connect to ground plane, and the PCB is a 2-layer,

10mm square with 2oz cooper thickness.

Recommended Operating Conditions

S ymbol

Pa ram eter

Ra nge

Unit

VCC P in Supp ly Voltage Rang e

2 to 6

V

PWM/V SP Pin Input Volta ge Range

V

Ambie nt Tempera tur e

-40 to 105

o

C

UO /V O/W O Pin A ver age Ou tp ut Curren t

0 to 4 00

mA

Note 3: Refer to the typical application circuit.