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80960 Fiches technique(PDF) 36 Page - Intel Corporation

No de pièce 80960
Description  3.3 V EMBEDDED 32-BIT MICROPROCESSOR
PDF  77 Pages
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Fabricant  INTEL [Intel Corporation]
Site Internet  http://www.intel.com
Logo INTEL - Intel Corporation

80960 Fiches technique(HTML) 36 Page - Intel Corporation

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80960JA/JF/JD/JT 3.3 V Microprocessor
36
Advance Information Datasheet
Table 14.
132-Lead PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
50
(0.25)
100
(0.50)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
θ
JC (Junction-to-Case)
4.1
4.3
4.3
4.3
4.3
4.7
4.9
θ
CA (Case-to-Ambient -No Heatsink)
23
19
18
16
14
11
9
NOTES:
1. This table applies to a PQFP device soldered directly into board.
2.
θJA = θJC + θCA
3.
θJL = 13°C/W (approx.)
4.
θJB = 13.5°C/W (approx.)
Table 15.
Maximum TA at Various Airflows in °C (80960JT)
Airflow-ft/min (m/sec)
fCLKIN (MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
PQFP
Package
TA without Heatsink
33
25
62
71
73
79
76
82
81
86
85
88
88
91
PGA
Package
TA without Heatsink
33
25
58
68
68
75
76
82
80
84
81
86
83
87
TA with Omnidirectional
Heatsink1
33
25
75
81
85
88
90
92
92
94
93
95
93
95
TA with Unidirectional
Heatsink2
33
25
73
79
86
90
90
92
92
94
93
95
93
95
MPBGA
Package
TA without Heatsink
33
25
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
NOTES:
1. 0.248” high omnidirectional heatsink (AI alloy 6061, 41 mil fin width, 124 mil center-to-center fin spacing).
2. 0.250” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 146 mil center-to-center fin spacing).
θ
JB
θ
JA
θ
JC
θ
JL
θ
CA



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