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VL53L0X Fiches technique(PDF) 36 Page - STMicroelectronics |
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VL53L0X Fiches technique(HTML) 36 Page - STMicroelectronics |
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36 / 40 page ![]() Packaging and labeling VL53L0X 36/40 DocID029104 Rev 1 8.5.2 Part handling Handling must be done with non-marring ESD safe carbon, plastic, or Teflon tweezers. Ranging module are susceptible to damage or contamination. A clean assembly process is advised at customer after un-taping the parts, and until a protective cover glass is mounted. 8.5.3 Compression force A maximum compressive load of 25N shall be applied on the module. 8.5.4 Moisture sensitivity level Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C 8.6 Storage temperature conditions Table 16. Recommended storage conditions Parameter Min. Typ. Max. Unit Temperature (storage) -40 +85 °C |
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