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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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PCF8833U/2DA Fiches technique(PDF) 108 Page - NXP Semiconductors |
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PCF8833U/2DA Fiches technique(HTML) 108 Page - NXP Semiconductors |
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108 / 112 page  2003 Feb 14 108 Philips Semiconductors Objective specification STN RGB - 132 × 132 × 3 driver PCF8833 18 TRAY INFORMATION handbook, full pagewidth MGU979 D C x y F E B Fig.63 Tray details. Table 101 Tray dimensions handbook, halfpage MGU980 Fig.64 Tray alignment. The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pad location diagram for the orientating and position of the type name on the die surface. DIMENSIONS DESCRIPTION VALUE B pocket pitch y direction 4.45 mm C pocket width x direction 23.07 mm D pocket width y direction 2.47 mm E tray width x direction 50.8 mm F tray width y direction 50.8 mm x number of pockets in x direction 1 y number of pockets in y direction 10 |
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