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MCP8024 Fiches technique(PDF) 13 Page - Microchip Technology

No de pièce MCP8024
Description  Internal Bandgap Reference
PDF  46 Pages
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Fabricant  MICROCHIP [Microchip Technology]
Site Internet  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP8024 Fiches technique(HTML) 13 Page - Microchip Technology

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 2013 Microchip Technology Inc.
DS20005228A-page 13
MCP8024
Note:
Unless otherwise indicated: TA = +25°C; Junction Temperature (TJ) is approximated by soaking the device under
test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the
rise in Junction temperature over the Ambient temperature is not significant.
FIGURE 2-13: 12V LDO Dynamic Loadstep -
Falling Current.
FIGURE 2-14: 12V LDO Output Voltage vs
Rising Input Voltage.
FIGURE 2-15: Quiescent Current vs
Temperature.
FIGURE 2-16: Trapezoidal Back EMF.
FIGURE 2-17: PWM Deadtime.
FIGURE 2-18: Buck Snubber Turn On.
-40
-30
-20
-10
0
10
20
30
40
0
5
10
15
20
25
Time (ms)
Vout (AC)
Vin = 14V
Vout = 12V
Cin = Cout = 10 µF
Iout = 20 mA to 1 mA Step
10.0
10.5
11.0
11.5
12.0
12.5
13.0
0
5
10
15
20
25
30
Vin (V)
Vout = 12V
Cin = Cout = 10 µF
Iout = 20 mA
Charge Pump
Hysteresis
0
200
400
600
800
1000
1200
-45
-20
5
30
55
80
105
130
155
Temperature (°C)
CE Low
CE High
0.0
0.5
1.0
1.5
2.0
2.5
Time ( ms)
PHA
PHB
PHC
0
102030405060
Time (µs)
Dead Time
Dead Time
PWMxH
PWMxL
0
4
8
12
16
20
0.10
0.12
0.14
0.16
0.18
0.20
Time (µs)
Snubber
No Snubber
Switch ON



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