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MCP8024 Fiches technique(PDF) 36 Page - Microchip Technology |
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MCP8024 Fiches technique(HTML) 36 Page - Microchip Technology |
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36 / 46 page ![]() MCP8024 DS20005228A-page 36 2013 Microchip Technology Inc. RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: SILK SCREEN Dimension Limits Units C1 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 3.80 3.80 MILLIMETERS 0.40 BSC MIN E MAX 5.00 Contact Pad Length (X40) Contact Pad Width (X40) Y1 X1 0.80 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2047-002A NOM 40-Lead Plastic Quad Flat, No Lead Package (MP) - 5x5 mm Body [QFN] With 3.7x3.7 mm Exposed Pad E C1 C2 Y2 X2 Y1 X1 C2 Contact Pad Spacing 5.00 |
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