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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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AN3213 Fiches technique(PDF) 44 Page - STMicroelectronics |
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AN3213 Fiches technique(HTML) 44 Page - STMicroelectronics |
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44 / 64 page  ST7570 demonstration board description AN3213 44/64 Doc ID 17429 Rev 1 Figure 39. Measured ST7570 thermal impedance curve (typical) The thermal impedance, as a response to dissipation at different duty cycle and duration values, can be estimated by simulating a 6-cell equivalent model obtained by the curve fitting from Figure 39, as shown in Figure 40. Figure 40. Simulation model of the thermal impedance ZthJA of the ST7570 mounted on the demonstration board The actual dissipated power PD can be calculated as: Equation 13 where and . Note that power consumption by receiving circuitry and linear regulators is considered negligible for thermal analysis purposes. The relationship between current absorption from the power supply (ICC) and PA output current to the load (IOUT) is shown in Figure 2. |
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