M24M01-R_12 datasheet(32/38 Pages) STMICROELECTRONICS

32 / 38 page

Package mechanical data

M24M01-R M24M01-DF

32/38

Doc ID 12943 Rev 10

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 15.

TSSOP8 – 8-lead thin shrink small outline, package outline

Drawing is not to scale.

Table 16.

TSSOP8 – 8-lead thin shrink small outline, package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to four decimal digits.

Typ.

Min.

Max.

Typ.

Min.

Max.

1.200

0.0472

0.050

0.150

0.0020

0.0059

1.000

0.800

1.050

0.0394

0.0315

0.0413

0.190

0.300

0.0075

0.0118

0.090

0.200

0.0035

0.0079

0.100

0.0039

3.000

2.900

3.100

0.1181

0.1142

0.1220

0.650

0.0256

6.400

6.200

6.600

0.2520

0.2441

0.2598

4.400

4.300

4.500

0.1732

0.1693

0.1772

0.600

0.450

0.750

0.0236

0.0177

0.0295

1.000

0.0394

0°

8°

0°

8°

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