TRF4002

PCS RF POWER AMPLIFIER

SLWS051 – JANUARY 1999

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POST OFFICE BOX 655303

Applications

3-V Supply and 1.9 GHz

37-dB Dynamic Range

PowerPAD

t(PWP)

description

The TRF4002 personal communications system (PCS) RF power amplifier is a gallium arsenide (GaAs),

integrated circuit housed in a 20-pin plastic surface-mount, thin-shrink small outline package (TSSOP). The

package has a solderable pad that improves the package thermal performance by bonding the pad to an

external thermal plane. The pad also acts as a low-inductance electrical path-to-ground and must be electrically

connected to the printed-circuit board (PCB) ground plane as a continuation of the regular package terminals

that are designated GND. The integrated circuit is suitable for 1.9-GHz code-division multiple-access (CDMA)

applications.

The TRF4002 is a power amplifier that uses a two-stage topology with an on-/off-chip output inductor and

impedance matching network to minimize cost. It is suitable for use in mobile systems that require high linearity.

It can deliver 27.5-dBm typical output power optimized for minimum adjacent channel power.

These devices have no built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments Incorporated.

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20

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GND

NC

NC

NC

NC

GND

GND

NC

NC

RFIN

RFIN

GND

PWP PACKAGE

(TOP VIEW)

NC – No internal connection

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Copyright

© 1999, Texas Instruments Incorporated