TRF4002

PCS RF POWER AMPLIFIER

SLWS051 – JANUARY 1999

7

POST OFFICE BOX 655303

MECHANICAL DATA

PWP (R-PDSO-G**)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

4073225/E 03/97

0,50

0,75

0,25

0,15 NOM

Thermal Pad

(See Note C)

Gage Plane

28

24

7,70

7,90

20

6,40

6,60

9,60

9,80

6,60

6,20

11

0,19

4,50

4,30

10

0,15

20

A

1

0,30

1,20 MAX

16

14

5,10

4,90

PINS **

4,90

5,10

DIM

A MIN

A MAX

0,05

Seating Plane

0,65

0,10

M

0,10

0

°–8°

20-PIN SHOWN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This solderable pad

is electrically and thermally connected to the backside of the die and possibly selected leads. The maximum pad size on the

printed-circult board should be equal to the package body size – 2,0mm.

PowerPAD is a trademark of Texas Instruments Incorporated.